Every time you utilize AI tools such as ChatGPT, countless optical beams are shuttling at high speed between chips behind the scene unbeknownst to you. The smarter AI grows, the greater the surging demand for computing power, which far outstrips the capacity of the traditional architecture built upon electrical interconnect plus pluggable optical transceivers.
Against this backdrop, CPO (Co-packaged Optics) emerges as the core breakthrough for AI infrastructure. By tightly co-packaging optical transceivers with chips, CPO enables more efficient and smoother transmission of computing power.

Why CPO Takes Off Globally?

In short: Mount optical engines right beside switching chips to shorten optical signal routing for faster speed and lower power consumption.Far beyond an incremental upgrade of optical transceivers, CPO marks a defining watershed for data centers shifting from electrical interconnect to all-optical interconnect.Large AI models demand Tbps-level bandwidth, ultra-low latency and reduced power draw — specifications perfectly satisfied by CPO technology.

How Prominent Is CPO in Today’s Industry?

Broadcom has rolled out Tomahawk 6 CPO switching chip, while NVIDIA developed Quantum-X Photonics exclusively for large-scale AI clusters. Per Yole’s forecast, the global CPO market will hit $8.1 billion by 2030 with a compound annual growth rate (CAGR) of 137%.
Far from a fleeting market concept, CPO has become the fundamental utility, akin to water, power and gas, that underpins all AI infrastructure.

I. Core Challenge of CPO: High-Precision Optical Alignment

The biggest hurdle of CPO lies not in packaging itself, but in ultra-precise optical alignment and stable interconnection. At this critical technical bottleneck, SUNA delivers high-precision silicon lens solutions compatible with multiple packaging architectures including Edge Coupling, Vertical Coupling and External Laser Source (ELS).
1. Edge Coupler: Light needs precise alignment with on-chip waveguides along the chip edge.
SUNA’s multi-ball lens array embedded with spacer balances structural robustness and spherical surface anti-contamination performance.
Custom multi-channel FA-V-groove fabricated via wet etching achieves zero cumulative tolerance for accurate fiber pitch matching.

2. Grating Coupler: Light is vertically refracted into on-chip waveguide.
SUNA has developed positioning-groove lens arrays fabricated via wafer-level lithography:
ROC array uniformity reaches ±1%, with pitch precision controlled within ±0.3μm; custom profile geometry and channel count are available on demand.
Integrated with 45° reflector and lens array, the component supports non-right-angle facet design to effectively suppress optical return loss and deliver stable optical beam shaping solutions.

3. ELS Solution
Within millimeter-scale optical paths, the dual-lens system constructs highly stable, high-precision high-efficiency optical channels.
To further boost coupling efficiency, SUNA’s double-sided orthogonal cylindrical lenses enable simultaneous beam spot modulation along both X and Y axes, delivering a coupling efficiency up to 95%, far exceeding the conventional upper design limit of 85%.

II. Why Top Global Customers Place Trust in SUNA?

In the CPO/NPO industry landscape, customers purchase far more than just lenses; they select guaranteed speed, reliability, robust technical foundation and predictable collaborative development.
SUNA has grown into a long-term strategic partner for leading global clients, underpinned by its exclusive 5T customer value system:

1. Technology | Pioneering Optical Solution Capability

SUNA’s full-product portfolio supports Edge, Grating and ELS architectures, delivering comprehensive solutions for CPO, NPO and Chiplet photonic integration.

2. fasT | Agile Response & Fast Delivery

Evaluation report within 2 working days, customized samples ready in 4 weeks
Wafer-scale manufacturing platform accelerates R&D and shortens solution rollout cycle.

3. trusT | Reliable Quality Assurance

SUNA holds 65% global market share in silicon lenses, adopted by over 90% domestic optical module manufacturers in China; zero critical quality incidents recorded to date with leading reliability reputation.

4. supporT | In-depth Collaborative Customer Support

The in-house R&D team provides simulation and testing service, participating deeply in customers’ structural design to build closed-loop collaboration from initial design to mass production.
5. cosT | Full-lifecycle Cost Competitiveness
Wafer-level mass production cuts per-unit component cost; integrated monolithic lens structure reduces assembly steps to lower total cost of ownership (TCO).

SUNA
2025.11.12