R&D Personnel
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Master's & Ph.D.s
500+
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R&D Investment
20%+
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Granted Patent
120+
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All Process in House
Adopting the IDM model, we cover full manufacturing procedures including lithography, etching, coating, CMP and testing, and support customized development.
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Core Key Technologies
Master core processes such as deep silicon etching, deep trench coating, nano imprint and TAKO thinning.
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Simulation & Testing
We own a library of over 700-type lens designs and support multi-physics field coupling capability. Our full-dimensional test platform includes wafer-level testing, RF testing and reliability testing.
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Customer Application Laboratory
We provide one-stop lab services covering lens coupling efficiency testing, grating diffraction efficiency testing, packaging verification and AEC-Q100 qualification.
Deep Silicon Etching and AuSn
Deep Silicon Etching
Capable of deep silicon etchin
with different aspect ratios.
BGBM
Capable of BGBM with
a thickness of 100um
Lens Etching
Unique,nanometer-precision
“simulated”eyching.
AuSn Capability
Development of AuSn(Au:Sn=75:25)
pre-form solder process
600+
In-plant equipment
170
R&D equipment