2022-08-26

Suna Optoelectronics: A Fully Domestic Chip Manufacturer Specializing in Wafer-Level Microlens Optical Solutions

The 24th China International Optoelectronic Exposition (CIOE 2022) will be held grandly in Shenzhen from September 7 to 9, 2022. As a leading fully domestic Chinese manufacturer of wafer-level optical microlenses, Suzhou SUNA Optoelectronics Co., Ltd. (hereinafter referred to as Suna Optoelectronics) will showcase its full range of products at Booth 6B808, Hall 6 of the Information Communication Exhibition. The product lineup includes silicon lenses, fused silica lenses, silicon-based micro-grooves/heat sinks/platform microlens arrays (MLAs), as well as complete series of detectors and lasers.

Invitation


Founded in 2014, Suzhou Suna Optoelectronics Co., Ltd. leverages the technological advantages of the Chinese Academy of Sciences. With the corporate vision of becoming the "China Core for Optical Communications and Optical Sensing," the company is committed to developing domestic chips with independent intellectual property and core competitiveness — breaking foreign monopolies, overcoming critical technological bottlenecks, and achieving high-end chip localization.
Suna's products sit at the uppermost tier of the optical communications industry chain. Its product portfolio includes silicon lenses, fused silica lenses, silicon-based heat sinks and micro-grooves, and InGaAs lasers and detectors. Among these, wafer-level microlens chips are the company's core product, serving over 130 domestic and international customers. Beyond optical communications, SUNA's wafer-level microlens chips are also widely used in LiDAR, non-contact temperature measurement (consumer electronics), automotive micro-projections (such as welcome lights), optical encoders (grating scales), and other applications, with mass shipments already delivered to leading manufacturers across these sectors.

SUNA currently employs over 130 people, including nearly 40 PhDs and master's degree holders with extensive experience in the semiconductor industry. The company owns its proprietary chip R&D and production lines, featuring 2,000㎡ of specialized cleanroom space (Class 100 and Class 1,000), and over 300 sets of semiconductor processing and testing equipment. These capabilities cover the entire chip manufacturing chain, including photolithography, etching, metal deposition, coating, thinning, polishing, dicing/scribing, screening, sorting, performance and reliability testing. The company has an annual chip production capacity of over 100 million units.


I. Product Series I: Wafer-Level Etched Silicon Lens Chips

Product Introduction

Application Areas: Optical modules, non-contact temperature measurement (mobile phones), 1550nm LiDAR;
Proven Track Record: Over 26 million units shipped stably in volume,proven through rigorous market and customer validation;
Proven Track Record: Over 26 million units shipped stably in volume,proven through rigorous market and customer validation;
Supply Options: Both standard off-the-shelf products (available to all customers) and custom mold opening services for customer-specific requirements.

Single lens

Single metal mark lens

Aspherical/spherical silicon lens array

Silicon Lens with Etched Ball Markers

front

reverse side

2×2 Silicon Lens Array (for non-contact temperature measurement)

II. Product Series II: Fused Silica Lenses / Gratings

Product Introduction

Application Areas: WSS (Wavelength Selective Switch), LiDAR (including 905nm), optical encoders (grating scales)

Product Capabilities: Capable of producing various types of fused silica lenses — spherical, aspherical, cylindrical, recessed/grooved, and other configurations.

Single diced saw cut lens

Recessed lens array

Grating

DOE

III. Product Series III: Microlens Array (MLA)

Product Introduction

Application Areas: Automotive welcome lights, brake warning lights, automatic parking indicators, autonomous driving ambient lighting, micro-projectors, and more.

Microlens array (MLA)

Showcase of Typical Application Scenarios

IV. Product Series IV: Silicon-Based Heat Sinks / Substrates / Platforms

Product Introduction

Application Areas: High-density optoelectronic packaging applications
Proven Track Record: Over 10 million units shipped stably in volume

Silicon-Based V-Groove

Cascaded Silicon Groove Products

V. Product Series V: Detectors / Lasers

Product Introduction

Applications:
Methane gas detection

InGaAs PD
(Φ300/500/1000/2000/3000μm)

Methane Detector (Φ500/1000μm) Methane Laser Bar


Looking ahead, Suna Optoelectronics will continue to adhere to its customer-centric approach, focusing on optical chips and semiconductor chips for applications in transmission, sensing, and information. The company will keep expanding its product lines in response to market demands, providing customers with chip products and services that deliver better performance, faster response, lower costs, and greater reliability.

SUNA
2022.8.26

Contact Us

Please feel free to contact us for more information.

SUZHOU

+86-512-67998900 (Sales Department Ext.8026)

E-mail:sales@suna-opto.com

North America

Ken Lee | Sales General Manager of North America

Products:Silicon Microlens / Fused Silica Microlens / Silicon Capacitor & IPD

E-mail:Ken.Lee@suna-opto.com

Tel:+1(510)813-0604

Europe

Laurent Lengignon | General Manager of Overseas Business Development

Products:Silicon Capacitor & Silicon IPD

E-mail:lengignonlaurent@suna-opto.com

Tel:+33624787992


Fei He | VP of International Operations

Products:Silicon Microlens / Fused Silica Microlens

E-mail:hefei@suna-opto.com

Tel:+86 18118136465

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