The 23rd Elexcon Shenzhen International Electronics Exhibition and Embedded Systems Exhibition successfully concluded at the Shenzhen International Convention and Exhibition Center. This year's event was held concurrently with the CIOE China Optoelectronics Expo, bringing together over 5,000 enterprises and focusing on cutting-edge sectors such as advanced packaging, infrared optoelectronics, embedded hardware, and micro-nano optics. By covering the entire supply chain — from chip design and packaging and testing to end-user computing applications—it stands as a highly prestigious annual electronics industry event in South China.

At this industry summit, SUNA – a company specializing in wafer-level micro-nano optics and silicon-based passive devices – made a high-profile debut with its core products, showcasing its comprehensive range of high-density silicon capacitor solutions designed for AI computing and advanced packaging applications.

As AI computing power continues to surge and high-performance chips alongside advanced packaging technologies undergo rapid evolution, traditional device solutions are increasingly encountering bottlenecks in terms of bandwidth, power consumption, and size. High-density silicon capacitors, owing to their advantages—including compact size, high capacitance, and low equivalent series inductance (ESL)—have become key passive components supporting the power supply for high-performance chips and the integration of advanced packaging ; they represent one of the key areas of focus for the industry in overcoming these challenges. Leveraging its comprehensive in-house manufacturing capabilities across the entire value chain, SUNA continuously provides core component support for high-speed interconnect and advanced packaging applications, helping reduce costs and enhance efficiency in computing infrastructure at the fundamental component level.

During the exhibition, SUNA's technical team engaged in in-depth discussions with visiting clients and industry partners, exploring topics such as challenges in advanced packaging and integration processes, mass-production consistency of devices, and customized development solutions for customers. They listened attentively to real market demands while sharing their practical experience in scaling up the mass production of silicon-based passive components. Many industry clients initiated further discussions on project validation and sample development, creating a vibrant  

Looking ahead, the overarching trend of computing power advancement will continue unabated. SUNA will remain deeply committed to the fields of wafer-level micro-nano optics and silicon-based passive devices, driving innovation through technological breakthroughs, continuously refining product performance, optimizing large-scale mass-production capabilities, and iteratively developing device solutions tailored for next-generation high-speed interconnects and advanced packaging technologies. Meanwhile, Suna will deepen its collaborative partnerships across the entire supply chain, working alongside industry peers to jointly overcome technical implementation challenges. By providing stable and reliable domestic core components, Suna will support the high-quality development of the optical communications and semiconductor advanced packaging industries, helping industry partners seize the new opportunities of the computing era.