Hosted by FiberOnline and Hexin Industry Research Center, the 10th China Fiber Connect Forum (CFCF 2025), an annual flagship summit for the optical communications industry, is scheduled to take place in Suzhou, China from June 16 to 18.As a landmark annual event within the optical communications sector, CFCF 2025 adheres to the core philosophy of “Driving industrial development via conferences with integrated technology and market development”. It serves as a comprehensive industry platform that integrates technical exchange, product showcase and market trend analysis for the entire optical communications ecosystem.

From June 16 to 18, SUNA Optoelectronics will adopt an integrated format combining on-site product exhibition and in-depth market discussion to fully display cutting-edge achievements across the entire optical communications industry chain.

AI training and inference rely on high-speed processing of massive datasets. As the core of underlying interconnection, optical communications serve as critical infrastructure underpinning the AI era via performance improvement and architectural innovation.Rising demand for higher transmission rates drives the evolution of optical modules from 100Gbps per wavelength toward 200Gbps and beyond, with corresponding signal bandwidth boosted to over 70GHz.

Optical modules convert high-speed electrical signals into optical signals, imposing stringent requirements on Signal Integrity. Compared with traditional ceramic capacitors, silicon capacitors deliver drastically reduced high-frequency insertion loss, preventing signal distortion above 40GHz, boosting coupling efficiency and securing superior signal integrity for optical modules.
Furthermore, silicon-based dielectric is free from piezoelectric effect, so the capacitance of silicon capacitors barely drifts with temperature or time, enabling long-term stable operation of high-speed optical modules. Within the interconnection network of 800G/1.6T high-speed optical modules, silicon capacitors are widely deployed in three scenarios:
High-speed signal link coupling
Power supply filtering for optical devices
Intermediate substrate for passive component integration
Microlenses are micron-scale optical components capable of focusing, diverging or shaping light beams. Driven by the rapid advancement of Artificial Intelligence (AI) and optical communication technologies in recent years, microlenses have demonstrated extensive application potential across both sectors thanks to their inherent strengths including compact form factor, high integration and low power consumption.

1. Applications of Microlenses in AI

AI Imaging & Sensing: Combined with structured light and ToF technology, microlens arrays are deployed for facial recognition, AR/VR and other use cases.
Edge AI Devices: Microlenses can be integrated into optical sensors of compact AI equipment such as drones and smart glasses to reduce footprint and optimize overall performance.

2. Applications of Microlenses in Optical Communications

Fiber Optic Communication
Improved Coupling Efficiency: Microlenses realize optical path coupling between optical fibers and lasers/photodetectors to reduce insertion loss, such as optical interfaces inside silicon photonic chips.
Multi-channel Parallel Transmission: Microlens arrays enable parallel processing of multi-wavelength optical signals, supporting optical interconnection for high-speed data centers (e.g., 400G/800G optical modules).
Integrated Photonic Devices
Combined with silicon photonics, microlenses optimize optical field distribution in Photonic Integrated Circuits (PIC) and facilitate the advancement of emerging technologies including Co-packaged Optics (CPO).

Fueled by the explosive advancement of AI technology, massive computing power demands are elevating the optical communications industry to new heights, with optoelectronic interconnection technology playing an increasingly critical role as the core infrastructure for data transmission. Surging AI computing requirements have driven skyrocketing market demand for optical transmission solutions including optical modules and optical interconnect components, making them major beneficiaries amid the AI boom.AI evolution is pushing the optical communications industry toward higher bandwidth and lower latency, while accelerating the commercial adoption of emerging technologies such as silicon photonics and Co-packaged Optics (CPO), further expanding into GPU interconnection solutions. In addition, continuous AI innovation imposes stricter specifications on the speed and bandwidth of optical links, spurring rapid iteration and upgrade of optical module and optical connection technologies and unlocking unprecedented opportunities across the optical communications sector.

SUNA
2025.6.17