Live from the Show Floor | SUNA Showcases Wafer-Level Microlenses, Silicon Capacitors, and Silicon IPDs at CIOE

The 25th China International Optoelectronic Exposition (CIOE) was held from September 11 to 13, 2024, at the Shenzhen World Exhibition and Convention Center. As a comprehensive exhibition covering the entire optoelectronics industry chain, CIOE brought together over 3,700 high-quality exhibitors from more than 30 countries and regions worldwide. The exhibition covers information communications, precision optics, camera technology and applications, lasers and intelligent manufacturing, infrared, ultraviolet, intelligent sensing, and next-generation displays. Spanning from components to end-use applications, the event serves nine major application sectors, helping to expand global business opportunities.

At this exhibition, SUNA primarily showcased the following main products:

I. Optical Communication Lenses

Wafer-level microlenses are primarily used in optical modules for AI and cloud data centers, serving the function of optical path shaping. They are mainly paired with lasers and detectors for beam collimation or focusing, making them core optical chips within optical modules. Compared with traditional glass lenses, silicon lenses offer the following advantages: higher refractive index, smaller spherical aberration, higher coupling efficiency; lower mold opening costs; and suitability for wafer-level manufacturing — enabling high production capacity, short production cycles, and significant potential for continuous cost reduction.

II. Wafer-Level Silicon Lenses for Infrared Temperature Measurement/Imaging

Wafer-level silicon lenses are widely used in infrared temperature measurement and imaging applications — including human body temperature monitoring, wearable devices, smart building energy-saving control, and human detection equipment. This product offers high optical quality and reliability, meeting customer requirements for customization and low cost. It is the ideal complement to thermopile chips and focal plane array chips.

III. Silicon Capacitors / Silicon IPDs

Silicon capacitor products are mainly used in high-speed optical modules, LiDAR, high-performance IC packaging, and other fields. They primarily serve as replacements for high-end MLCC ceramic capacitors. Compared with ceramic capacitors, silicon capacitors offer key advantages including high-temperature tolerance, high bandwidth, high-voltage tolerance, high reliability, and low thickness (≤100μm).
Silicon IPD chips mainly replace traditional ceramic substrates. Compared with traditional ceramic substrates, silicon-based IPDs offer key advantages including high integration, excellent high-frequency characteristics, and the ability to reduce the number of discrete components and packaging steps for customers.

SUNA
2024.9.11