Wire-Bonding Array Silicon Capacitor
Wirebonding silicon capacitor array features integrated design to save mounting space, streamline assembly steps and prevent glue overflow. With a slim thickness of 100μm, it operates steadily from -55℃ to 150℃, and its capacitance remains stable regardless of bias voltage, perfectly fit for multi-channel filtering of TOSA and ROSA optical chips.
Technical Features

•Integrated design for further mounting area reduction

•Fewer mounting processes and adhesive overflow prevention

•High stability: capacitance remains unchanged with bias voltage

•Operating temperature range: -55 ~ 150℃

•Ultra-thin design: thickness of 100 μm

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