2D TSV silicon via array developed by SUNA-opto is a high-precision optical interconnection device for OCS Application. The thickness of the silicon via array is 2mm, the aperture accuracy is controlled within 125.75um~127.25um, and the pitch accuracy is ±0.3um, which can ensure the high parallelism of the via array. It supports customized via array channel number, and adapts to the multi-channel optical interconnection requirements of optical switches.