IPD product (integrated with RC) and silicon substrate product suit EML lasers and silicon photonic chips, dimension 1.8*0.82*0.45mm. IPD specs: REAM=50ohm, CEAM=10nF, CLD=200pF; -1dB bandwidth over 67GHz, return loss ~-20dB. Adopting RC integration, preformed AuSn paste & TSV tech, it cuts BOM and mounting cost with better high-frequency reliability vs ceramic substrates. Lower customization cost & shorter lead time than overseas rivals; standard test samples available.
Technical Features (Reference Design)
•3D Dimensions: 1.8×0.82×0.45mm
•Integrated Passive Component Parameters:
• REAM=50ohm
• CEAM=10nF, CLD=200pF
•Insertion Loss -1dB Bandwidth up to over 67GHz
•Return Loss maintained at -20dB
•Universal samples are available for performance testing
